Nanomechanics has unsurpassed expertise in mechanical characterization of low-κ materials. We offer a variety of indentation tests that include a depth profile of elastic modulus and hardness using the Continuous Stiffness Measurement (CSM), Elasticity Ratio/Elastic Work results that determine the amount of elasticity present in the indentation, and substrate independent indentation results that provide the most accurate way to analyze and compare low-κ films of varying thicknesses.

In addition to nanoindentation, Nanomechanics has unparalleled expertise in performing scratch tests on low-κ films. We have our own custom scratch test methods for creating highly reproducible interface failure between the low-κ film and silicon substrate. Also, we have dramatically increased repeatability in these tests by identifying sources of variability and eliminating them. In our labs, we perform thousands of scratch tests per year, specifically on low-κ’s, and this experience has led to new test techniques that have revolutionized scratch testing. We provide results with precision and long term repeatability.

Low-k Specific Test Techniques

Thin film nanoindentation for elastic modulus and hardness measurements

DCM CSM for Thin Films

DCM CSM for Low-k Films

Thin film elastic recovery testing

Nanomechanics’ Residual Indentation Depth and Elasticity Ratio

Thin film scratch testing

Nanomechanics’ Low-k Scratch Test

Nanomechanics’ Scratch Elasticity Test

Thin film failure analysis

Imaging of failure